Data centres are consuming alarming amounts of electricity and are responsible for a significant portion of global energy-related emissions. Switzerland-based Lightium aims to provide a solution by accelerating the performance of data centres and reducing their energy consumption with a next generation of photonic chips.
Traditional semiconductor technologies are hitting physical and operational limits. To overcome these limitations, Lightium has developed thin-film lithium niobate (TFLN) photonic chips. This glass-like material can deliver faster transmission rates and overcome silicon’s limitations.
Lightium’s TFLN photonic chips can deliver transmission rates of 1.6 or 3.2Tb/s, compared to the current maximum rate of 800Gb/s. This leap in transmission rates means handling more data and doing so more efficiently, resulting in reduced operational costs and significant energy savings.
Lightium has raised $7mn in seed funding to accelerate the commercialisation of its production-grade TFLN Photonic Integrated Circuits (PICs) foundry services. The Swiss startup expects to hit this launch target at the beginning of 2025 and is currently running a closed beta pilot with strategic partners.
The company plans to integrate its technology across various sectors, such as satellite communications and quantum computing. A key benefit of TFLN chips is their potential to reduce Europe’s reliance on traditional semiconductor supply chains, promoting digital sovereignty.
Key Benefits of Lightium’s Solution