Taiwan’s E&R Engineering is pioneering the use of glass substrates for advanced packaging, launching its “E-Core System” initiative and establishing the “Glass Substrate Supplier E-Core System Alliance.” This program aims to bring glass substrates into the mainstream for next-generation chips and high-speed communication devices.
The alliance brings together several key players, including Manz AG, Scientech, Hyawei Optronics, Lincotec, STK Corporation, Skytech, and Group Up. This combined expertise will enable the E-Core Alliance to deliver end-to-end glass substrate solutions to customers both globally and within Taiwan’s semiconductor industry.
In chipmaking, substrates form the foundation upon which the integrated circuit is built. Glass substrates offer denser wiring, faster signal transmission, extreme flatness, and the ability to withstand high heat and voltages. These properties make glass ideal for AI chips and other applications that demand advanced packaging with superior density and performance.
The coalition partners handle several key steps in manufacturing glass substrates, including creating through-glass vias (TGV), wet etching, automated optical inspection, sputtering, ABF lamination, and precision cutting of massive panels. E&R has made a significant breakthrough in the crucial TGV laser drilling step, achieving a throughput of 8,000 vias per second for fixed layouts and 600-1,000 vias per second for custom designs.
Major chipmaking companies such as TSMC, Intel, Samsung Electronics, and Huawei are also investing heavily in R&D for glass substrates. With E&R’s latest advancements and the collective expertise of the E-Core Alliance, glass substrates are poised to revolutionize the future of chipmaking and AI chips.
The recent launch of E&R Engineering’s “E-Core System” initiative in Taipei signals a significant shift in the semiconductor industry. By committing to glass substrates for advanced packaging, the company paves the way for the widespread adoption of this technology.
Glass substrates offer numerous advantages over copper, including denser wiring, faster signal transmission, extreme flatness, and high heat and voltage resistance. These properties make glass an ideal material for AI chips and applications requiring advanced packaging with superior density and performance.
E&R Engineerging’s collaboration with an unnamed North American IDM customer has led to a significant breakthrough in the TGV laser drilling step, increasing throughput from 10-50 vias per second to 8,000 vias per second for fixed layouts. This achievement makes glass substrates viable for mass manufacturing.
Key companies such as TSMC, Intel, Samsung Electronics, and Huawei are also investing heavily in R&D for glass substrates, solidifying the material’s place in the future of chipmaking and AI chips.